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115-13-624-41-003

MILL-MAX Mfg. Corp

MILL-MAX Mfg. Corp 115-13-624-41-003
  • Lifecycle status
    Discontinued
  • RoHS
    RoHS compliant
  • REACH
    REACH compliant
  • Description
    IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder
  • Category
    Interconnects Sockets and Chip Carriers
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8536.90.40.00
  • SB Code
    8536.90.40.00
  • Body Depth
    0.094 inch
  • Body Length
    1.2 inch
  • Body Breadth
    0.7 inch
  • Contact Style
    RND PIN-SKT
  • JESD-609 Code
    e4
  • Current Rating
    1 A
  • Mounting Style
    STRAIGHT
  • Terminal Pitch
    2.54 mm
  • Contact Material
    NOT APPLICABLE
  • Housing Material
    GLASS FILLED POLYETHYLENE POLYESTER
  • Termination Type
    SOLDER
  • Additional Feature
    DIP SOCKET
  • Device Socket Type
    IC SOCKET
  • Number of Contacts
    24
  • Device Type Used On
    DIP24
  • PCB Contact Pattern
    RECTANGULAR
  • Mating Contact Pitch
    0.1 inch
  • Contact Configuration
    RECTANGLE
  • Insulation Resistance
    10000000000 ohm
  • Contact Finish - Mating
    NOT APPLICABLE
  • PCB Contact Row Spacing
    15.24 mm
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Contact Finish - Termination
    Gold (Au) - with Nickel (Ni) barrier
  • Dielectric Withstanding Voltage
    1000VAC V

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115-13-624-41-003
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115-13-624-41-003