10A474S3DF by Integrated Device Technology, Inc. | Sourcengine

Integrated Device Technology, Inc. 10A474S3DF

Lifecycle status
Transferred
REACH
REACH compliant
Description
CDIP 30.86x10.16x2.92 mm 2.54mm Pitch
Category
Semiconductors Memory ICs SRAMs STANDARD SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
SEPARATE
Technology
BICMOS
Width (mm)
10.16
Length (mm)
30.861
JESD-30 Code
R-CDIP-T24
Memory Width
4
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
STANDARD SRAM
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL EXTENDED
Terminal Position
DUAL
Memory Organization
1KX4
Number of Functions
1
Number of Terminals
24
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
3
Number of Words Code
1K
Memory Density (bits)
4096
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
OPEN-EMITTER
Seated Height-Max (mm)
4.445
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1024
Package Equivalence Code
DIP24,.4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
75
Operating Temperature-Min (Cel)
0