100-008-051
3M
- Lifecycle statusEOL
- RoHSRoHS compliant
- DescriptionCONN IC DIP SOCKET 8POS GOLD
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8536.69.40.40
- SB Code8536.69.40.40
- Body Depth0.161 inch
- Body Length0.4 inch
- Body Breadth0.4 inch
- Contact StyleRND PIN-SKT
- JESD-609 Codee4
- Current Rating1 A
- Mounting StyleSTRAIGHT
- Terminal Pitch2.54 mm
- Contact MaterialBERYLLIUM COPPER
- Housing MaterialGLASS FILLED POLYPHENYLENE SULFIDE
- Termination TypeSOLDER
- Additional Feature3M
- Device Socket TypeIC SOCKET
- Number of Contacts8
- Device Type Used OnDIP8
- PCB Contact PatternRECTANGULAR
- Mating Contact Pitch0.1 inch
- Insulation Resistance1000000000 ohm
- Contact Finish - MatingGOLD (8) OVER NICKEL (100)
- PCB Contact Row Spacing7.62 mm
- Operating Temperature-Max125 Cel
- Operating Temperature-Min-65 Cel
- Contact Finish - TerminationGold (Au) - with Nickel (Ni) barrier
- Dielectric Withstanding Voltage1400VAC V
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100-008-051