Advanced Micro Devices, Inc. (AMD) 100-000001316E
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    TSMC
  • Width (mm)
    25
  • Length (mm)
    35
  • JESD-30 Code
    R-PBGA-B1140
  • Package Code
    LFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1140
  • Terminal Pitch (mm)
    0.64
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.38
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    100

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100-000001316E
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100-000001316E