MT44K32M36RB-093E:A by Micron Technology | Sourcengine

Micron Technology MT44K32M36RB-093E:A

Lifecycle status
NRFND
RoHS
RoHS compliant
REACH
REACH compliant
Description
DRAM Chip RLDRAM3 1.125Gbit 32Mx36 1.35V 168-Pin BGA Tray
Category
Semiconductors Memory ICs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
13.5000
Access Mode
MULTI BANK PAGE BURST
Length (mm)
13.5000
JESD-30 Code
S-PBGA-B168
Memory Width
36
Package Code
TBGA
Self Refresh
NO
Package Shape
SQUARE
Package Style
GRID ARRAY, THIN PROFILE
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Memory IC Type
DDR DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Finish
TIN SILVER COPPER
Terminal Position
BOTTOM
Additional Feature
AUTO REFRESH
Memory Organization
32MX36
Number of Functions
1
Number of Terminals
168
Terminal Pitch (mm)
1.000
Number of Words Code
32M
Memory Density (bits)
1207959552.0000000000000000
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.2000
Supply Voltage-Max (V)
1.42000
Supply Voltage-Min (V)
1.28000
Supply Voltage-Nom (V)
1.35
Number of Words (words)
33554432.0000000000000000
Sequential Burst Length
2,4,8
Standby Current-Max (A)
0.225000000000000
Supply Current-Max (mA)
1140.000000000000000
Interleaved Burst Length
2,4,8
Package Equivalence Code
BGA168,13X13,40
Clock Frequency-Max (MHz)
1075.20000
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
95.0
Operating Temperature-Min (Cel)
0.0
Time@Peak Reflow Temperature-Max (s)
30