MT44K32M18RB-107E:B

Micron Technology

Micron Technology MT44K32M18RB-107E:B
  • Lifecycle status
    NRFND
  • RoHS
    RoHS compliant
  • REACH
    REACH compliant
  • Description
    DRAM Chip DDR RLDRAM3 576Mbit 32Mx18 1.35V 168-Pin TBGA Tray
  • Category
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Technology
    CMOS
  • Width (mm)
    13.5000
  • Access Mode
    MULTI BANK PAGE BURST
  • Length (mm)
    13.5000
  • JESD-30 Code
    S-PBGA-B168
  • Memory Width
    18
  • Package Code
    TBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    DDR DRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO REFRESH
  • Memory Organization
    32MX18
  • Number of Functions
    1
  • Number of Terminals
    168
  • Terminal Pitch (mm)
    1.000
  • Number of Words Code
    32M
  • Memory Density (bits)
    603979776.0000000000000000
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2000
  • Supply Voltage-Max (V)
    1.42000
  • Supply Voltage-Min (V)
    1.28000
  • Supply Voltage-Nom (V)
    1.35
  • Number of Words (words)
    33554432.0000000000000000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    95.0
  • Operating Temperature-Min (Cel)
    0.0
  • Time@Peak Reflow Temperature-Max (s)
    30

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