XQR18V04VQ44N

Xilinx,Inc.

Xilinx,Inc. XQR18V04VQ44N
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Type
    NOR TYPE
  • Endurance
    2000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G44
  • Package Code
    QFP
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4194304 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Terminal Pitch
    0.8 mm
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Supply Current-Max
    50 mA
  • Number of Terminals
    44
  • Standby Current-Max
    0.02 Amp
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    10
  • Package Equivalence Code
    TQFP44,.47SQ,32
  • Operating Temperature-Max
    100 Cel
  • Operating Temperature-Min
    -55 Cel
  • Clock Frequency-Max (fCLK)
    20 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    240
  • Time@Peak Reflow Temperature-Max (s)
    30

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