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XQR1701LCCG44V

Xilinx,Inc.

Xilinx,Inc. XQR1701LCCG44V
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Total Dose
    50k Rad(Si) V
  • Width (mm)
    16.51
  • Length (mm)
    16.51
  • JESD-30 Code
    S-CQCC-J44
  • Memory Width
    1
  • Package Code
    QCCJ
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e3
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    1MX1
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    1M
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    4.826
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1048576
  • Clock Frequency-Max (MHz)
    15
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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XQR1701LCCG44V