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XQR1701LCC44M

Xilinx,Inc.

Xilinx,Inc. XQR1701LCC44M
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • Width
    16.51 mm
  • Length
    16.51 mm
  • Technology
    CMOS
  • Total Dose
    50k Rad(Si) V
  • JESD-30 Code
    S-CQCC-J44
  • Memory Width
    1
  • Organization
    1MX1
  • Package Code
    QCCJ
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Memory Density
    1048576 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Number of Words
    1048576 words
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Seated Height-Max
    4.826 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    44
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    15 MHz

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XQR1701LCC44M