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XQ17V16VQ44N

Xilinx,Inc.

Xilinx,Inc. XQ17V16VQ44N
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • Width
    10 mm
  • Length
    10 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G44
  • Memory Width
    8
  • Organization
    2MX8
  • Package Code
    TQFP
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    16777216 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    20 ns
  • Number of Words
    2097152 words
  • Parallel/Serial
    PARALLEL/SERIAL
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Supply Current-Max
    100 mA
  • Number of Functions
    1
  • Number of Terminals
    44
  • Standby Current-Max
    0.001 Amp
  • Number of Words Code
    2M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    TQFP44,.47SQ,32
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    33 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    240
  • Time@Peak Reflow Temperature-Max (s)
    30

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XQ17V16VQ44N