XCZU67DR-L1FSVE1156I

Xilinx,Inc.

Xilinx,Inc. XCZU67DR-L1FSVE1156I
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    35 mm
  • Length
    35 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B1156
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    1 mm
  • Seated Height-Max
    4.01 mm
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    0.892 V
  • Supply Voltage-Min
    0.808 V
  • Supply Voltage-Nom
    0.85 V
  • Number of Terminals
    1156
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA1156,34X34,40
  • Operating Temperature-Max
    100 Cel
  • Operating Temperature-Min
    -40 Cel
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE RFSoC

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