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XC7372-12PQ160C

Xilinx,Inc.

Xilinx,Inc. XC7372-12PQ160C
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.55
  • JTAG BST
    NO
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G160
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    NO
  • Number of Terminals
    160
  • Terminal Pitch (mm)
    0.635
  • Number of Macro Cells
    72
  • Package Body Material
    PLASTIC/EPOXY
  • In-System Programmable
    NO
  • Propagation Delay (ns)
    12
  • Programmable Logic Type
    OT PLD
  • Package Equivalence Code
    QFP160,1.2SQ
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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XC7372-12PQ160C
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XC7372-12PQ160C