ProductsManufacturers
Events
Send an RFQBOM Tool

XC18V256VQG44I

Xilinx,Inc.

Xilinx,Inc. XC18V256VQG44I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    10 mm
  • Length
    10 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G44
  • Memory Width
    8
  • Organization
    32KX8
  • Package Code
    TQFP
  • JESD-609 Code
    e3
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    262144 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    15 ns
  • Number of Words
    32768 words
  • Parallel/Serial
    PARALLEL/SERIAL
  • Terminal Finish
    Matte Tin (Sn)
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    44
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for XC18V256VQG44I

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XC18V256VQG44I
Send an RFQ
XC18V256VQG44I