XC18V02VQ44C
Xilinx,Inc.
- Lifecycle statusEOL
- DescriptionFPGA - Configuration Memory 2MB 3.3 VOLT ISP CONFIGURATION PROM
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.51
- SB Code8542.32.00.50
- TypeNOR TYPE
- Width10 mm
- Length10 mm
- Endurance20000 Write/Erase Cycles
- TechnologyCMOS
- JESD-30 CodeS-PQFP-G44
- Memory Width8
- Organization256KX8
- Package CodeTQFP
- JESD-609 Codee0
- Package ShapeSQUARE
- Package StyleFLATPACK, THIN PROFILE Meter
- Surface MountYES
- Terminal FormGULL WING
- Memory Density2097152 bit
- Memory IC TypeCONFIGURATION MEMORY
- Operating ModeSYNCHRONOUS
- Terminal Pitch0.8 mm
- Access Time-Max20 ns
- Number of Words262144 words
- Parallel/SerialPARALLEL/SERIAL
- Terminal FinishTIN LEAD
- Seated Height-Max1.2 mm
- Temperature GradeINDUSTRIAL
- Terminal PositionQUAD
- Supply Current-Max25 mA
- Number of Functions1
- Number of Terminals44
- Standby Current-Max0.01 Amp
- Number of Words Code256K
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Data Retention Time-Min20
- Package Equivalence CodeTQFP44,.47SQ,32
- Operating Temperature-Max85 Cel
- Operating Temperature-Min-40 Cel
- Supply Voltage-Max (Vsup)3.6 V
- Supply Voltage-Min (Vsup)3 V
- Supply Voltage-Nom (Vsup)3.3 V
- Clock Frequency-Max (fCLK)20 MHz
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)240
- Time@Peak Reflow Temperature-Max (s)30
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XC18V02VQ44C