ProductsManufacturers
Events
Send an RFQBOM Tool

XC17V16VQG44C

Xilinx,Inc.

Xilinx,Inc. XC17V16VQG44C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-PQFP-G44
  • Memory Width
    8
  • Package Code
    TQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL/SERIAL
  • Terminal Finish
    Matte Tin (Sn)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Memory Organization
    2MX8
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    2M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2097152
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for XC17V16VQG44C

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XC17V16VQG44C
Send an RFQ
XC17V16VQG44C