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XC17S150APDG8C

Xilinx,Inc.

Xilinx,Inc. XC17S150APDG8C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    7.62
  • Length (mm)
    9.3599
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e3
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Matte Tin (Sn)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1040096X1
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Number of Words Code
    1040096
  • Memory Density (bits)
    1040096
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.5974
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1040096
  • Programming Voltage (V)
    5
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    DIP8,.3
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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XC17S150APDG8C