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WEDF1M32B-70HI5A

Microsemi Corporation

Microsemi Corporation WEDF1M32B-70HI5A
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    30.1 mm
  • Length
    30.1 mm
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • JESD-30 Code
    S-CPGA-P66
  • Memory Width
    32
  • Organization
    1MX32
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory Density
    33554432 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    70 ns
  • Number of Words
    1048576 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    6.22 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    USER CONFIGURABLE AS 4M X 8
  • Number of Functions
    1
  • Number of Terminals
    66
  • Programming Voltage
    5 V
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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WEDF1M32B-70HI5A