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WEDF1M32B-120G2UI5A

Microsemi Corporation

Microsemi Corporation WEDF1M32B-120G2UI5A
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Width (mm)
    22.36
  • Length (mm)
    22.36
  • JESD-30 Code
    S-CQFP-G68
  • Memory Width
    32
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    USER CONFIGURABLE AS 4M X 8
  • Memory Organization
    1MX32
  • Number of Functions
    1
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    120
  • Number of Words Code
    1M
  • Memory Density (bits)
    33554432
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Alternate Memory Width
    16
  • Seated Height-Max (mm)
    4.57
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1048576
  • Programming Voltage (V)
    5
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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WEDF1M32B-120G2UI5A