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W78M64V90SBM

Microsemi Corporation

Microsemi Corporation W78M64V90SBM
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM/TOP
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B159
  • Memory Width
    64
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH MODULE
  • Parallel/Serial
    PARALLEL
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    8
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Memory Organization
    8MX64
  • Number of Terminals
    159
  • Sector Size (words)
    4K,32K
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    90
  • Number of Words Code
    8M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    16,254
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    8388608
  • Standby Current-Max (A)
    0.00015
  • Supply Current-Max (mA)
    180
  • Package Equivalence Code
    BGA159,10X16,50
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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W78M64V90SBM