W631GG6NB-12 by Winbond Electronics Corporation | Sourcengine

Winbond Electronics Corporation W631GG6NB-12

Lifecycle status
Discontinued
RoHS
RoHS compliant
REACH
REACH compliant
Description
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin VFBGA
Category
Semiconductors Memory ICs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.32
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
Width (mm)
7.5000
Access Mode
MULTI BANK PAGE BURST
Length (mm)
13.0000
JESD-30 Code
R-PBGA-B96
Memory Width
16
Package Code
VFBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
OTHER
Terminal Position
BOTTOM
Memory Organization
64MX16
Number of Functions
1
Number of Terminals
96
Terminal Pitch (mm)
0.800
Access Time-Max (ns)
20.0000000000000000
Number of Words Code
64M
Memory Density (bits)
1073741824.0000000000000000
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.0000
Supply Voltage-Max (V)
1.57500
Supply Voltage-Min (V)
1.42500
Supply Voltage-Nom (V)
1.5
Number of Words (words)
67108864.0000000000000000
Sequential Burst Length
8
Standby Current-Max (A)
0.040000000000000
Supply Current-Max (mA)
220.000000000000000
Interleaved Burst Length
8
Package Equivalence Code
BGA96,9X16,32
Clock Frequency-Max (MHz)
800.00000
Operating Temperature-Max (Cel)
95.0
Operating Temperature-Min (Cel)
0.0