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W55M06

Winbond Electronics Corporation

Winbond Electronics Corporation W55M06
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Memory Width
    1
  • Organization
    6MX1
  • Memory Density
    6291456 bit
  • Memory IC Type
    MASK ROM
  • Number of Words
    6291456 words
  • Temperature Grade
    COMMERCIAL
  • Supply Current-Max
    2 mA
  • Standby Current-Max
    1.0E-6 Amp
  • Number of Words Code
    6M
  • Qualification Status
    Not Qualified
  • Package Equivalence Code
    DIE OR CHIP
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    4.5 V

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W55M06
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W55M06