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TMX320C82GGP50

Texas Instruments Incorporated

Texas Instruments Incorporated TMX320C82GGP50
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.35
  • SB Code
    8542.31.00.35
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B352
  • Package Code
    HBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    YES
  • Low Power Mode
    NO
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    352
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.165
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    64
  • Clock Frequency-Max (MHz)
    50
  • Internal Bus Architecture
    MULTIPLE
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, MIXED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Screening Level / Reference Standard
    TS 16949

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TMX320C82GGP50
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TMX320C82GGP50