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TMS320M642AGDK7

Texas Instruments Incorporated

Texas Instruments Incorporated TMS320M642AGDK7
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.35
  • SB Code
    8542.31.00.35
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • RAM (words)
    4096
  • JESD-30 Code
    S-PBGA-B548
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    23
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • Number of Terminals
    548
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.8
  • Supply Voltage-Max (V)
    1.44
  • Supply Voltage-Min (V)
    1.36
  • Supply Voltage-Nom (V)
    1.4
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA548,26X26,32
  • Clock Frequency-Max (MHz)
    75.19
  • Internal Bus Architecture
    MULTIPLE
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER
  • Peak Reflow Temperature (Cel)
    220
  • Operating Temperature-Max (Cel)
    90
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    20

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TMS320M642AGDK7