Texas Instruments Incorporated TMS320C6670AXCYP
  • ECCN
    5A002.A.1.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    24 mm
  • Format
    FLOATING POINT
  • Length
    24 mm
  • Bit Size
    32
  • Technology
    CMOS
  • RAM (words)
    32768
  • JESD-30 Code
    S-PBGA-B841
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • JESD-609 Code
    e1
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • Low Power Mode
    YES
  • Terminal Pitch
    0.8 mm
  • Terminal Finish
    TIN SILVER COPPER
  • Integrated Cache
    YES
  • Number of Timers
    16
  • Seated Height-Max
    3.39 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    1.05 V
  • Supply Voltage-Min
    0.95 V
  • Supply Voltage-Nom
    1 V
  • Number of Terminals
    841
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    80
  • Package Equivalence Code
    BGA841,29X29,32
  • Internal Bus Architecture
    SINGLE
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, MIXED
  • Peak Reflow Temperature (Cel)
    245
  • Time@Peak Reflow Temperature-Max (s)
    30

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