TRW LSI PRODUCTS INC TMC2301L1V1
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    S-XQFP-F68
  • Package Code
    QFF
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Terminal Pitch
    1.27 mm
  • Screening Level
    38535Q/M;38534H;883B
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Supply Voltage-Nom
    5 V
  • Number of Terminals
    68
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    QFL68,.95SQ
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • uPs/uCs/Peripheral ICs Type
    BIT-SLICE MICROPROCESSOR

0 suppliers available to buy or to bid for TMC2301L1V1

Send an RFQ

Negotiated savings, bought with a click.

Send an RFQ
TMC2301L1V1
Send an RFQ
TMC2301L1V1