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TLV9062SIYCKR

Texas Instruments Incorporated

Texas Instruments Incorporated TLV9062SIYCKR
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Low-Bias
    YES
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    YES
  • Technology
    CMOS
  • Width (mm)
    0.95
  • Length (mm)
    0.95
  • JESD-30 Code
    S-XBGA-B9
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • J-STD-609 Code
    e1
  • Packing Method
    TR
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • Voltage Gain-Min
    158489.3
  • Terminal Position
    BOTTOM
  • Programmable Power
    NO
  • Number of Functions
    2
  • Number of Terminals
    9
  • Terminal Pitch (mm)
    0.35
  • Slew Rate-Nom (V/us)
    6.5
  • Package Body Material
    UNSPECIFIED
  • Frequency Compensation
    YES
  • Seated Height-Max (mm)
    0.33
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    1.6
  • Unity Gain BW-Nom (kHz)
    10000
  • Package Equivalence Code
    BGA9,3X3,14
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    6
  • Input Offset Voltage-Max (uV)
    1600
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Common-mode Reject Ratio-Min (dB)
    57
  • Common-mode Reject Ratio-Nom (dB)
    103

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TLV9062SIYCKR
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TLV9062SIYCKR