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TLV314IDCKRG4

Texas Instruments Incorporated

TLV314IDCKRG4 Datasheet
Texas Instruments Incorporated TLV314IDCKRG4
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Low-Bias
    NO
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    YES
  • Technology
    CMOS
  • Width (mm)
    1.25
  • Length (mm)
    2
  • JESD-30 Code
    R-PDSO-G5
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • J-STD-609 Code
    e4
  • Packing Method
    TR
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • Voltage Gain-Min
    17782.79
  • Terminal Position
    DUAL
  • Programmable Power
    NO
  • Number of Functions
    1
  • Number of Terminals
    5
  • Terminal Pitch (mm)
    0.65
  • Slew Rate-Nom (V/us)
    1.5
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    0.25
  • Unity Gain BW-Nom (kHz)
    3000
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    7
  • Input Offset Voltage-Max (uV)
    3000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Common-mode Reject Ratio-Min (dB)
    72
  • Common-mode Reject Ratio-Nom (dB)
    96
  • Time@Peak Reflow Temperature-Max (s)
    30

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TLV314IDCKRG4