Texas Instruments Incorporated TLV2460CD
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Width
    3.9 mm
  • Length
    4.9 mm
  • Low-Bias
    NO
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    NO
  • Technology
    CMOS
  • Architecture
    VOLTAGE-FEEDBACK
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    SOP
  • Sub Category
    Operational Amplifier
  • JESD-609 Code
    e4
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Slew Rate-Min
    0.8 V/us
  • Slew Rate-Nom
    1.6 V/us
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    General Purpose
  • Packing Method
    TUBE
  • Terminal Pitch
    1.27 mm
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Voltage Gain-Min
    31622
  • Seated Height-Max
    1.75 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Unity Gain BW-Nom
    6400 kHz
  • Programmable Power
    NO
  • Supply Current-Max
    0.65 mA
  • Number of Functions
    1
  • Number of Terminals
    8
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Input Offset Voltage-Max
    2000 uV
  • Package Equivalence Code
    SOP8,.25
  • Supply Voltage Limit-Max
    6 V
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    3 V
  • Moisture Sensitivity Level
    1
  • Bias Current-Max (IIB) @25C
    0.014 uA
  • Common-mode Reject Ratio-Min
    71 dB
  • Common-mode Reject Ratio-Nom
    85 dB
  • Peak Reflow Temperature (Cel)
    260
  • Average Bias Current-Max (IIB)
    0.025 uA
  • Input Offset Current-Max (IIO)
    0.007 uA
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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TLV2460CD