Toshiba Corporation TC74HCT7007AF(EL,F)
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Max I(ol)
    4 Amp
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G14
  • Package Code
    SOP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Packing Method
    TR
  • Terminal Pitch
    1.27 mm
  • Schmitt Trigger
    NO
  • Number of Inputs
    1
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    6
  • Number of Terminals
    14
  • Prop. Delay@Nom-Sup
    28 ns
  • Qualification Status
    Not Qualified
  • Load Capacitance (CL)
    50 pF
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (tpd)
    28 ns
  • Package Equivalence Code
    SOP14,.3
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Number of Elements
    6

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TC74HCT7007AF(EL,F)