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TB62719AF

Toshiba Corporation

Toshiba Corporation TB62719AF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    BICMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • Display Mode
    SEGMENT
  • JESD-30 Code
    S-PQFP-G64
  • Package Code
    HTFQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • fmax-Min (MHz)
    20
  • Data Input Mode
    SERIAL/PARALLEL
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    LED DISPLAY DRIVER
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    COMMON-CATHODE
  • Number of Segments
    16
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    QFP64,.47SQ,20
  • Number of Digits/Characters
    16-DIGIT
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Multiplexed Display Capability
    NO
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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TB62719AF
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TB62719AF