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T6684FP

Toshiba Corporation

Toshiba Corporation T6684FP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-F43
  • Memory Width
    8
  • Package Code
    QFF
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Memory Organization
    32MX8
  • Number of Functions
    1
  • Number of Terminals
    43
  • Terminal Pitch (mm)
    1
  • Memory Density (bits)
    268435456
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    QFL43,.55X.8,40
  • Operating Temperature-Max (Cel)
    55
  • Operating Temperature-Min (Cel)
    -10

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T6684FP