STMicroelectronics N.V. STM32F217IGH6
  • ECCN
    5A992.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Speed
    120 rpm
  • Width
    10 mm
  • Length
    10 mm
  • Bit Size
    32
  • CPU Family
    CORTEX-M3
  • Technology
    CMOS
  • Peripherals
    BOR, CRC, DMA(16), PDR, POR, PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(16), WDT(2)
  • RAM (bytes)
    131072
  • ROM (words)
    1048576
  • ADC Channels
    YES
  • Connectivity
    CAN(2), I2C(3), I2S(2), SPI(3), UART(2), USART(4), USB
  • DAC Channels
    YES
  • DMA Channels
    YES
  • JESD-30 Code
    S-PBGS-B201
  • PWM Channels
    YES
  • Package Code
    FBGA
  • JESD-609 Code
    e2
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    0.635 mm
  • Terminal Finish
    Tin/Silver (Sn/Ag)
  • Number of Timers
    16
  • Address Bus Width
    26
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    81 mA
  • Supply Voltage-Max
    3.6 V
  • Supply Voltage-Min
    1.8 V
  • Supply Voltage-Nom
    2.7 V
  • Clock Frequency-Max
    26 MHz
  • Number of I/O Lines
    140
  • Number of Terminals
    201
  • ROM Programmability
    FLASH
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    16
  • External Data Bus Width
    16
  • Package Equivalence Code
    BGA201,15X15,25
  • On Chip Program ROM Width
    8
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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STM32F217IGH6
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STM32F217IGH6