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SST27SF512-70-3C-WH

SILICON STORAGE TECHNOLOGY INC

SILICON STORAGE TECHNOLOGY INC SST27SF512-70-3C-WH
  • ECCN
    3A991.b.1.b.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    8
  • Length (mm)
    12.4
  • Data Polling
    NO
  • JESD-30 Code
    R-PDSO-G32
  • Memory Width
    8
  • Package Code
    TSOP1
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    64KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    70
  • Number of Words Code
    64K
  • Memory Density (bits)
    524288
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    NO
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    65536
  • Programming Voltage (V)
    12
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    TSSOP32,.56,20
  • Peak Reflow Temperature (Cel)
    240
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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SST27SF512-70-3C-WH