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SMJ626162-20HKD

MICROSS COMPONENTS

MICROSS COMPONENTS SMJ626162-20HKD
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • Width
    16.5 mm
  • Length
    21 mm
  • Technology
    CMOS
  • Access Mode
    DUAL BANK PAGE BURST
  • JESD-30 Code
    R-CDFP-F50
  • Memory Width
    16
  • Organization
    1MX16
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    16777216 bit
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    10 ns
  • Number of Ports
    1
  • Number of Words
    1048576 words
  • Seated Height-Max
    3.55 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    AUTO REFRESH
  • Number of Functions
    1
  • Number of Terminals
    50
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    3.465 V
  • Supply Voltage-Min (Vsup)
    3.135 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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SMJ626162-20HKD
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SMJ626162-20HKD