SF-0603HI500M-2
Bourns, Inc.
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionFuse Chip 5A 32V SMD Solder Pad 0603 Ceramic T/R
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8536.10.00.40
- SB Code8536.10.00.40
- Fuse Size0603
- Packing MethodTR, 7 INCH
- Terminal ShapeWRAPAROUND
- Body Height (mm)0.8
- Mounting FeatureSURFACE MOUNT
- Body Breadth (mm)0.8
- Rated Current (A)5
- Blow CharacteristicFAST
- Joule-integral-Nom (J)3.283
- Rated Voltage (DC) (V)32
- Circuit Protection TypeELECTRIC FUSE
- Rated Breaking Capacity (A)50
- Body Length or Diameter (mm)1.6
- Trip Time or Delay (Seconds)0.0002
- Operating Temperature-Max (Cel)125
- Operating Temperature-Min (Cel)-55
- Screening Level / Reference StandardUL
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SF-0603HI500M-2