Cypress Semiconductor Corporation S29GL01GS11FHI020
  • ECCN
    3A991.B.1.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    11 mm
  • Length
    13 mm
  • Page Size
    16 words
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Sector Size
    64K Words
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B64
  • Memory Width
    16
  • Organization
    64MX16
  • Package Code
    LBGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    EEPROM CARD
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    110 ns
  • Number of Words
    67108864 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Seated Height-Max
    1.4 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    80 mA
  • Number of Functions
    1
  • Number of Terminals
    64
  • Programming Voltage
    2.7 V
  • Standby Current-Max
    0.0001 Amp
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    1K
  • Package Equivalence Code
    BGA64,8X8,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3 V
  • Moisture Sensitivity Level
    3
  • Write Cycle Time-Max (tWC)
    6.0E-5 ms
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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S29GL01GS11FHI020