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RM7065C-XXXM

Microsemi Corporation

RM7065C-XXXM Datasheet
Microsemi Corporation RM7065C-XXXM
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    BGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO OPERATES AT 3.3 V; 216-PIN EXPOSEDPAD PACKAGE
  • Number of Terminals
    256
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    2.5
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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RM7065C-XXXM
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RM7065C-XXXM