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RD28F6432JC3T

Intel Corporation

Intel Corporation RD28F6432JC3T
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    TOP
  • Technology
    CMOS
  • Width (mm)
    8
  • Length (mm)
    14
  • JESD-30 Code
    R-PBGA-B68
  • Memory Width
    16
  • Package Code
    LFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    TOP BOOT BLOCK
  • Memory Organization
    6MX16
  • Number of Functions
    1
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    120
  • Number of Words Code
    6M
  • Memory Density (bits)
    100663296
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    3.3
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    6291456
  • Programming Voltage (V)
    3.3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

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RD28F6432JC3T