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PEEL18CP210P-30

INTEGRATED CIRCUIT TECHNOLOGY CORP

INTEGRATED CIRCUIT TECHNOLOGY CORP PEEL18CP210P-30
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.55
  • Technology
    CMOS
  • Architecture
    PLA-TYPE
  • JESD-30 Code
    R-PDIP-T20
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Number of Inputs
    18
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    10
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    30
  • Supply Voltage-Nom (V)
    5
  • Number of Product Terms
    42
  • Programmable Logic Type
    EE PLD
  • Package Equivalence Code
    DIP20,.3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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PEEL18CP210P-30
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PEEL18CP210P-30