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PCK2010RDL

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS PCK2010RDL
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G56
  • Package Code
    SSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Terminal Pitch
    0.635 mm
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    160 mA
  • Number of Terminals
    56
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SSOP56,.4
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel

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PCK2010RDL
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PCK2010RDL