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P3Z22V10-BDH

Xilinx,Inc.

Xilinx,Inc. P3Z22V10-BDH
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.55
  • Technology
    CMOS
  • Architecture
    PAL-TYPE
  • JESD-30 Code
    R-PDSO-G24
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Output Function
    MACROCELL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Number of Inputs
    22
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    10
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    15
  • Supply Voltage-Nom (V)
    3.3
  • Number of Product Terms
    132
  • Programmable Logic Type
    EE PLD
  • Package Equivalence Code
    TSSOP24,.25
  • Clock Frequency-Max (MHz)
    69
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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P3Z22V10-BDH