ProductsManufacturers
Events
Send an RFQBOM Tool

N82S185BN

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS N82S185BN
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    TTL
  • JESD-30 Code
    R-PDIP-T18
  • Memory Width
    4
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTP ROM
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    2KX4
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    35
  • Number of Words Code
    2K
  • Memory Density (bits)
    8192
  • Package Body Material
    PLASTIC/EPOXY
  • Number of Words (words)
    2048
  • Supply Current-Max (mA)
    155
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for N82S185BN

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
N82S185BN
Send an RFQ
N82S185BN