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MT58V1MV18DT-6

Micron Technology

Micron Technology MT58V1MV18DT-6
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    14
  • Length
    20
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    18
  • Organization
    1MX18
  • Package Code
    LQFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    18874368
  • Memory IC Type
    CACHE SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    .65
  • Access Time-Max
    3.5
  • Number of Words
    1048576
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Seated Height-Max
    1.6
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Supply Current-Max
    250
  • Number of Functions
    1
  • Number of Terminals
    100
  • Standby Current-Max
    .03
  • Standby Voltage-Min
    2.38
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    QFP100,.63X.87
  • Operating Temperature-Max
    70
  • Operating Temperature-Min
    0
  • Supply Voltage-Max (Vsup)
    2.625
  • Supply Voltage-Min (Vsup)
    2.375
  • Supply Voltage-Nom (Vsup)
    2.5
  • Clock Frequency-Max (fCLK)
    166

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MT58V1MV18DT-6
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MT58V1MV18DT-6