MT44H8M32F1FW-18 by Micron Technology | Sourcengine

Micron Technology MT44H8M32F1FW-18

Lifecycle status
Active
REACH
REACH compliant
Description
DDR3 DRAM, 8MX32, CMOS, PBGA135
Category
Semiconductors Memory ICs DRAMs DDR3 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.24
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
Width (mm)
12
Access Mode
FOUR BANK PAGE BURST
Length (mm)
13
JESD-30 Code
R-PBGA-B135
Memory Width
32
Package Code
TFBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Memory IC Type
DDR3 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
4096
Number of Ports
1
Terminal Finish
TIN SILVER COPPER
DLA Qualification
Not Qualified
Temperature Grade
OTHER
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
8MX32
Number of Functions
1
Number of Terminals
135
Terminal Pitch (mm)
0.8
Number of Words Code
8M
Memory Density (bits)
268435456
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
8388608
Sequential Burst Length
4,8
Package Equivalence Code
BGA135,11X15,40/32
Clock Frequency-Max (MHz)
550
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0