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MM28C010-300MP

SEEQ TECHNOLOGY INC

SEEQ TECHNOLOGY INC MM28C010-300MP
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    YES
  • JESD-30 Code
    R-XDMA-T32
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    64
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    AUTOMATIC WRITE;PAGE WRITE
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    300
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    UNSPECIFIED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Programming Voltage (V)
    5
  • Standby Current-Max (A)
    0.002
  • Supply Current-Max (mA)
    70
  • Package Equivalence Code
    DIP32,.6
  • Endurance (Write/Erase Cycles)
    10000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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MM28C010-300MP
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MM28C010-300MP