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ML2650HB

LAPIS Semiconductor Co., Ltd.

LAPIS Semiconductor Co., Ltd. ML2650HB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • JESD-30 Code
    S-PBGA-B36
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Consumer IC Type
    AUDIO AMPLIFIER
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Functions
    2
  • Number of Terminals
    36
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA36,6X6,16

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ML2650HB
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ML2650HB