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MH32S64TR3N-8

Mitsubishi Electric Corp.

Mitsubishi Electric Corp. MH32S64TR3N-8
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-XXMA-X
  • Memory Width
    64
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    UNSPECIFIED
  • Memory IC Type
    SRAM MODULE
  • DLA Qualification
    Not Qualified
  • Terminal Position
    UNSPECIFIED
  • Memory Organization
    32KX64
  • Number of Functions
    1
  • Access Time-Max (ns)
    8
  • Number of Words Code
    32K
  • Memory Density (bits)
    2097152
  • Package Body Material
    UNSPECIFIED
  • Number of Words (words)
    32768

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MH32S64TR3N-8
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MH32S64TR3N-8