Advanced Micro Devices, Inc. (AMD) MD8231A-3B
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    15.24 mm
  • Length
    32.0675 mm
  • Technology
    MOS
  • JESD-30 Code
    R-CDIP-T24
  • Package Code
    DIP
  • Boundary Scan
    NO
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Barrel Shifter
    NO
  • Terminal Pitch
    2.54 mm
  • Screening Level
    MIL-STD-883 Class B (Modified)
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    0
  • Seated Height-Max
    5.588 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Current-Max
    100 mA
  • Supply Voltage-Max
    5.25 V
  • Supply Voltage-Min
    4.75 V
  • Supply Voltage-Nom
    5 V
  • Clock Frequency-Max
    3.125 MHz
  • Number of Terminals
    24
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • External Data Bus Width
    8
  • Package Equivalence Code
    DIP24,.6
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • uPs/uCs/Peripheral ICs Type
    MATH PROCESSOR, COPROCESSOR

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MD8231A-3B
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MD8231A-3B