MCIMX31LCJKN5D
NXP Semiconductors NV
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionSoC, CMOS, PBGA457
- Category
- HTS Code8542.31.00.01
- SB Code8542.31.00.00
- Width14 mm
- Length14 mm
- TechnologyCMOS
- JESD-30 CodeS-PBGA-B457
- Package CodeLFBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY, LOW PROFILE, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- Terminal Pitch0.5 mm
- Seated Height-Max1.3 mm
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Supply Voltage-Max1.65 V
- Supply Voltage-Min1.52 V
- Number of Terminals457
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Package Equivalence CodeBGA457,26X26,20
- Operating Temperature-Max85 Cel
- Operating Temperature-Min-40 Cel
- uPs/uCs/Peripheral ICs TypeSYSTEM ON CHIP
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
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