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LMX9830SMX

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMX9830SMX
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    9
  • JESD-30 Code
    R-PBGA-B60
  • Package Code
    LFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    60
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.3
  • Supply Voltage-Nom (V)
    2.75
  • Supply Current-Max (mA)
    0.065
  • Package Equivalence Code
    BGA60,6X10,32
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    235
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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LMX9830SMX
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LMX9830SMX